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Microwave and Millimeter-Wave Electronic Packaging


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Artech House | English | 2014 | ISBN-10: 1608076970 | 261 Pages | PDF | 15.78 mb
by Rick Sturdivant (Author, Editor)

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.
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